| 发明名称 |
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| 摘要 |
Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surface, the frame being connected to the bottom plate and surrounding the semiconductor bodies, at least one control line for each thyristor tablet having first and second sections, each of the first sections being firmly connected to a respective one of the control electrodes and having an end facing away from the one control electrode, the ends each being adjacent the inner surface of the frame and including a contact region, each of the second sections being mechanically connected to the frame and having a contact region in contact with the contact region of a respective one of the first sections, and the second sections each including a contact terminal accessible from outside the module. |
| 申请公布号 |
DE3232157(C2) |
申请公布日期 |
1989.12.21 |
| 申请号 |
DE19823232157 |
申请日期 |
1982.08.30 |
| 申请人 |
SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE |
发明人 |
EGERBACHER, WERNER;VOGT, HERBERT, 8000 MUENCHEN, DE;WUNDERLICH, DIETER, 8031 GEISENBULLACH, DE |
| 分类号 |
H01L23/049;H01L23/495;H01L25/07 |
主分类号 |
H01L23/049 |
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