发明名称 CHIP TYPE DEVICE TO BE FIXED TO CIRCUIT BOARD
摘要 PURPOSE: To eliminate the need for annealing that requires much energy, by retaining a functional substrate by forming a gap also in a case using support elements, separating a total outer surface from the inner surface of a case, and forming a support surface smaller as compared with the surface of the functional substrate. CONSTITUTION: Connection elements 7 and 8 project from a case 9 made of a plastic material at the junction part between a packet 18 and a lid 19 and is bent along the surface of the case 9, and contact surfaces 26 and 27 are formed at the lower side of the packet 18. Also, a functional substrate 2 is retained by forming a gap 10 within the case 9 by a support element 12, and the gap is 1mm or shorter. Then, the total outer surface of the functional substrate 2 is surrounded by the gap 10 excluding a small support surface 13 of the support element 12 and is separated from a case inner surface 11, thus eliminating the need for an additional action, for example, for annealing a capacitor roll.
申请公布号 JPH01315122(A) 申请公布日期 1989.12.20
申请号 JP19890098638 申请日期 1989.04.17
申请人 SIEMENS AG 发明人 FUERUDEINANTO UTONAA
分类号 H01G4/12;H01C1/02;H01C17/00;H01C17/02;H01G2/02;H01G2/06;H01G4/18;H01G4/224;H01G4/252;H01G9/004;H01G9/06;H01G9/08 主分类号 H01G4/12
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