发明名称 Circuit board laminate
摘要 <p>A circuit board laminate comprising a circuit board (8) and a baseplate (2). The baseplate (2) is machined to provide flat top projections (4) having chamfered edges (16). The circuit board (8) having etched copper tracks is soldered to these projections providing improved mechanical and electrical connections. An improved grounding connection is also proposed, whereby a plated through hole (20) in the board is disposed above the chamfered edges of the projection. <IMAGE></p>
申请公布号 GB2219892(A) 申请公布日期 1989.12.20
申请号 GB19880014364 申请日期 1988.06.16
申请人 * THE PLESSEY COMPANY PLC 发明人 SIMON JOHN * CANTRELL;MARTIN A * READ
分类号 H05K1/02;H05K3/00;H05K3/34;H05K9/00 主分类号 H05K1/02
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