发明名称 |
Circuit board laminate |
摘要 |
<p>A circuit board laminate comprising a circuit board (8) and a baseplate (2). The baseplate (2) is machined to provide flat top projections (4) having chamfered edges (16). The circuit board (8) having etched copper tracks is soldered to these projections providing improved mechanical and electrical connections. An improved grounding connection is also proposed, whereby a plated through hole (20) in the board is disposed above the chamfered edges of the projection. <IMAGE></p> |
申请公布号 |
GB2219892(A) |
申请公布日期 |
1989.12.20 |
申请号 |
GB19880014364 |
申请日期 |
1988.06.16 |
申请人 |
* THE PLESSEY COMPANY PLC |
发明人 |
SIMON JOHN * CANTRELL;MARTIN A * READ |
分类号 |
H05K1/02;H05K3/00;H05K3/34;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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