发明名称 |
Resin composition for solder resist ink |
摘要 |
A resin composition for use in a solder resist ink, said composition comprising as essential ingredients (A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 mol, per epoxy group of the epoxy resin, of an unsaturated monobasic acid in (A-b) an organic and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) a photopolymerization initiator, and (C) a curing agent of an amino group and/or imino group-containing epoxy resin.
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申请公布号 |
US4888269(A) |
申请公布日期 |
1989.12.19 |
申请号 |
US19880231606 |
申请日期 |
1988.08.11 |
申请人 |
DAINIPPON INK & CHEMICALS, INC.;ASAHI CHEMICAL RESEARCH LABORATORY, LTD. |
发明人 |
SATO, YONEJI;HOSHINO, MASATO;KITAZAWA, SEIICHI;YASUDA, TADASHI |
分类号 |
B23K35/22;G03F7/032;H05K3/28 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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