发明名称 RESIN COMPOSITION FOR MOLDING MATERIAL
摘要 PURPOSE:To obtain a resin composition excellent in dimensional accuracy, dimensional stability, moldability and physical properties by adding a specified inorganic filler to a mixture of a specified polyamide mixture with a (co)polymer of a vinyl monomer. CONSTITUTION:The title resin composition is prepared by adding 30-250 pts.wt. inorganic filler (B) comprising 20-85 pts.wt. glass filler (a) comprising 5-90 pts.wt. glass fiber comprising both chopped strand and milled fiber and 95-10 pts.wt. glass beads and 80-15 pts.wt. calcium carbonate (b) to 100 pts.wt. resin composition (A) comprising 60-100 pts.wt. polyamide resin mixture comprising 50-99 pts.wt. polyamide resin obtained from xylylenediamine and a linear aliphatic alpha,omega-dibasic acid and 50-1 pt.wt. polyamide 66 and 40-0 pt.wt. polymer or copolymer obtained by polymerizing a vinyl monomer.
申请公布号 JPH01313557(A) 申请公布日期 1989.12.19
申请号 JP19880144644 申请日期 1988.06.14
申请人 MITSUBISHI GAS CHEM CO INC 发明人 NOMURA ISAO;NARITA KENICHI;FUJISHIRO TAKESHI
分类号 C08L77/06;C08K3/10;C08K3/26;C08K7/14;C08K7/20;C08L77/00 主分类号 C08L77/06
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