| 摘要 |
A wire bonding force calibration meter for measuring automatically a force applied thereto and for displaying the value of the force is provided. The meter is particularly useful, in combination with a wire bonding machine, which bonds wires to silicon dice and to hybrid substrate pads by applying a force on the wires. The meter automatically measures the static setup force applied by the machine on the wires, and automatically measures the dynamic bonding force applied by the machine on the wires. The machine is used particularly for bonding wires in a hybrid. The meter overcomes the problem of manual measurement of the static setup force and the problem of not being able to measure the dynamic bonding force. The meter includes a transducer for sensing a force applied thereto, a charge amplifier connected to the transducer, a sample and hold unit connected to the charge amplifier, a converter connected to the sample and hold unit, and a memory unit connected to the converter and having a display for indicating the value of the applied force.
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