发明名称 |
Apparatus for connecting external leads |
摘要 |
An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.
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申请公布号 |
US4887758(A) |
申请公布日期 |
1989.12.19 |
申请号 |
US19890302473 |
申请日期 |
1989.01.26 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
SUZUKI, YASUNOBU;KATO, MOTOHIKO;BANDO, AKIO;ISHIDA, HISAO;NISHIMURA, AKIHIRO |
分类号 |
H01L21/60;H01L21/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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