发明名称 SYNTHETIC RESIN FILM, METHOD AND DEVICE FOR MOLDING THEREOF IN UNIFORM THICKNESS
摘要 PURPOSE:To obtain the film having uniform thickness and less uneven thickness by a method in which the thickness of a completed film is measured by a film thickness-measuring device, and on the basis of said film thickness-measured value, the corresponding relation between the uneven thickness part of the film and the heating element adjacent to a die lip, is obtained by computing, and then the generated heat by the corresponding heating element is controlled corresponding to the unevenness amount of the uneven thickness part. CONSTITUTION:The film thickness after forming is measured through a film thickness- measuring device 8, and said measured value is inputted into an arithmetic unit 7. In the arithmetic unit 7, the necessary measuring position wherein measuring position is caused to correspond with the film thickness in the measured data of film thickness, is caused to correspond with the necessary position of a die lip 2a, and a plurality of heating elements 5 provided on the peripheral edge of the die lip is caused to correspond with the data of the necessary film thickness in the measured data of film thickness. The electrically controlled value controlling the generated heat of each heating element 5 correspondingly to each heating element 5 is computed so that the uniform film thickness data in said measured data of film thickness is obtained, based on the film thickness data corresponding to each heating means. A film 3 is formed by drawing out molten resin from the die 2 in which each heating element 5 is controlled by the electrically controlled value thus obtained, whereby the synthetic resin film with uniform thickness is obtained.
申请公布号 JPH01314135(A) 申请公布日期 1989.12.19
申请号 JP19880143694 申请日期 1988.06.13
申请人 TOMY KIKAI KOGYO KK 发明人 NIIMOTO SANEMI
分类号 B29C47/22;B29C47/86;B29C47/92;B29L7/00 主分类号 B29C47/22
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