发明名称 |
High thermal resistance bonding material and semiconductor structures using same |
摘要 |
A high thermal resistance bonding material for semiconductor chips includes a binder such as epoxy or polyimide and high thermal resistance material dispersed therein such as glass micropheres, glass beads, ceramic microspheres and ceramic beads. The particles of high thermal resistance material are sieved to obtain particles of generally uniform size. In plastic-encapsulated semiconductor chips, each chip is enveloped by the bonding material. |
申请公布号 |
US4888634(A) |
申请公布日期 |
1989.12.19 |
申请号 |
US19890307234 |
申请日期 |
1989.02.03 |
申请人 |
LINEAR TECHNOLOGY CORPORATION |
发明人 |
LAI, CHONG K.;DOBKIN, ROBERT C. |
分类号 |
H01L23/29;H01L23/31;H01L23/495 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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