发明名称 |
Method for manufacturing plastic encapsulated semiconductor devices |
摘要 |
A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings. |
申请公布号 |
US4888307(A) |
申请公布日期 |
1989.12.19 |
申请号 |
US19870090142 |
申请日期 |
1987.08.27 |
申请人 |
SGS MICROELETTRONICA S.P.A. |
发明人 |
SPATRISANO, ANTONIO PERNICIARO;CELLAI, MARINO |
分类号 |
B29C33/12;B29C45/14;B29C70/72;H01L21/56;H01L23/31 |
主分类号 |
B29C33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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