| 摘要 |
PURPOSE:To strengthen jointing of a moulding resin structurally, and shorten a resin setting time during moulding the resin by arranging a recessed part having a cavity wider than its opening on a jointing surface of a metallic substrate with the resin. CONSTITUTION:A semiconductor apparatus includes a metal substrate 1, and a semiconductor element 5 placed thereon. A pit 3 having wider cavity than its opening size is arranged on the surface of substrate 1 on which a resin is to be jointed. A moulding resin 4 made of epoxy resin, etc., is moulded such that the pit 3 is filled with the resin 4. At this time the pit 3 is designed such that the diameter of the cavity is 1.2 times of the diameter of the opening. On the metal substrate 1 having such shape, the semiconductor element 5 is placed. Then, connection is made between the electrodes of the semiconductor element 5 and external lead wires 2 connected to the metal substrate 1, using a thin metal wire of aluminum or gold. Then, the metal substrate 1 is moulded with the moulding resin 4 using a transfer moulding machine, etc. Thus, sturdy mechanical jointing of the moulding resin 4 and the metal substrate 1 is achieved. |
