| 摘要 |
PURPOSE:To form a uniform protective film all over and to increase protection reliability by covering each part on a supporting substrate with a CVD film through optical CVD after connecting a semiconductor device and the outside with a bonding wire. CONSTITUTION:When covering each part on a supporting substrate 52 whose surface 52a at the side to mount and support a semiconductor device 50 is an optical mirror face 53 with a CVD film 55, the semiconductor device 50 and the outside are connected by a bonding wire 51 and then each part on the supporting substrate 52 are covered with a CVD film 55 through optical CVD which irradiates photoenergy line 54 from a slanting direction against the supporting substrate 52. That is, the photoenergy line 54 is reflected to the mirror face 53 and irradiated uniformly and fully to a rear section of the bonding wire 51 as well. According to this constitution, a uniform protective film can be formed generally, and protection reliability can be increased. |
