| 摘要 |
PURPOSE:To facilitate the confirmation of pads to be bonded during the assembling process by a method wherein electrode pads with pad identification codes are provided. CONSTITUTION:Multiple pads 2 taking rectangular or square shape are juxtaposed along a semiconductor integrated circuit 1 to be led out by gold wire or aluminum wire bonding process. The bonding wires are bonded onto the ranges displayed by the circles while pad identification codes 4 are written on every four corners of the pads 2 not to be hidden by any slipped bonding positions. Furthermore, respective pads 2 are provided with different pad identification codes e.g. Arabic numerals etc., in series from '1' to facilitate the identification. Through these procedures, any pad to be bonded during the assembling process can be easily confirmed so that the objective pad may be immediately found out of numerous pads in order to evaluate the electrical properties in a state of wafer. |
