发明名称 LEAD FRAME
摘要 <p>PURPOSE:To dispense with a manufacturing stage of separating and removing connecting bars for an improved productivity by a method wherein connecting bars, positioned between inner leads and preventing sealing resin from running, are built of an insulating material. CONSTITUTION:A lead frame 2 of this design incorporates a die pad 1 which is elastically held by suspension leads 3 in the lead frame 2 and mounted with a semiconductor element 4, inner leads 7 which are connected by wires 6 to the semiconductor element 4 on the die pad 1, leads 5 which are provided with outer leads 8 connecting to the inner leads 7, and connecting bars 21 which are built of an insulating material and positioned in the leads 5 between the inner leads 7 and prevent a sealing resin from running. With the lead frame 2 being designed as such, a manufacturing stage will be dispensed with of separating and removing the connecting bars 21, which simplifies the manufacturing process and shortens the time required for manufacture.</p>
申请公布号 JPH01310571(A) 申请公布日期 1989.12.14
申请号 JP19880142228 申请日期 1988.06.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 AKIYAMA TATSUHIKO;TONE YOSHIMORI
分类号 H01L23/50 主分类号 H01L23/50
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