发明名称 BENDING MACHINE FOR ELECTRONIC CIRCUIT COMPONENT LEAD
摘要 PURPOSE:To prevent a lead from being broken and to make a device small-sized by providing a 1st forming machine to vertically bend the outermost lead, arranging a 2nd forming machine to correct a lead interval and setting a carrying means of electronic components between these forming machines. CONSTITUTION:Supporting boxes 12, 13 are provided on a frame box 11, and a stamping machine 21, the 1st forming machine 26 and the 2nd forming machine 16 are arranged successively. A carrying means having pulleys 14, 15 and a conveyor belt 16 for the electronic component 1 is arranged between the boxes 12, 13. In the component 1 carried into the belt 16, the tip of the lead 2 is cut by a stamping machine 21 and bent vertically by sliders 39, 40 in the 1st forming machine 26. After the conveyor 16 is moved, the 2nd forming machine 16 is clamped by sliders 76, 79, 82 and correcting projections 88, etc., correct the interval of the lead 2. Since bending and correction are performed separately, the lead is prevented from being broken and since structure is simple, the device is small-sized.
申请公布号 JPH01309725(A) 申请公布日期 1989.12.14
申请号 JP19880139138 申请日期 1988.06.06
申请人 TEIJIN SEIKI CO LTD 发明人 OGAWA MASAO
分类号 B21D13/02;B21D5/01;H01G13/00;H01L23/48;H05K13/04 主分类号 B21D13/02
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