发明名称 SOLDERING MEMBER OF HIGH-FREQUENCY INDUCTION HEATING SOLDERING
摘要 PURPOSE:To carryout satisfactory soldering by forming soldering members so that wall thickness of a part situated in the vicinity of the root where a heating value of a heating coil is reduced becomes thin and making the soldering members to the uniform temperature all over. CONSTITUTION:A lens holder 15 and an optical semiconductor device member 9 are set in the heating coil 10 in order to carryout soldering. The lens holder 15 is worked with an insertion hole 15a of the optical semiconductor device member 9 made eccentric in order to make the wall thickness of the part B of the root thin. In addition, a ball lens 1 is fitted in the lens holder 15 and fixed thereon by the method such as fixing by an adhesive and further, a ferrule 4 to which an optical fiber 3 is adhered is fixed thereon by a cap nut 5. Thus, since the wall thickness of the part of the soldering members where the heating value is reduced is made thin, the heating value of this part can be increased and the soldering members can be made to the uniform temperature all over.
申请公布号 JPH01309781(A) 申请公布日期 1989.12.14
申请号 JP19880139384 申请日期 1988.06.08
申请人 OKI ELECTRIC IND CO LTD 发明人 OKOHARA HAJIME
分类号 B23K1/002;B23K3/04;H01L31/02;H01L31/0232;H01L33/58 主分类号 B23K1/002
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