MIT KUNSTSTOFF UMHUELLTE, INTEGRIERTE MULTICHIP-HYBRIDSCHALTUNG

摘要

A hybrid circuit includes an insulative film (5) bonded to a first area of a die attach pad, a second area (3A) of the die attach pad being exposed. A plurality of individual metalized strips (6, 11, 12) and a first die attach area (7) are formed on the film. A first integrated circuit die, (8), such as a low power MOS chip, is bonded to the first die attach area, and a second integrated circuit die (13), such as a high power bipolar chip, is bonded to the second area of the die attach pad. Bonding wires (16) are bonded to connect various bonding pads (9, 14) of the two integrated circuit dice to various metalized strips (6, 11, 12) on the insulative film and to lead frame fingers (2). The dice, bonding wires, die attach pad, lead frame fingers, and insulative film are encapsulated in plastics by transfer molding.