Chip capacitor of layered design

摘要

Chip capacitor of layered design, having a capacitor body which is built up as a stack of layers, the upper side and underside of which are terminated by outer film layers of thermoplastic material, and which is surrounded on its lateral surfaces by a sheathing of heat-resistant insulating material. To increase the heat resistance of the capacitor for the soldering operation, the outer film layers are of a plastic material of which the melting point lies at least 20@C higher than that of the polyester films which are used with preference as rating foils of the capacitor.