| 摘要 |
<p>A device for applying solder to two opposite faces of an object, such as an array of conductors (23) of a flat electrical cable (21), in a predetermined location, comprises a support sheet (1) having a line of weakness (3) along which the sheet can be folded to define two arms (5), each having a free end (7); a quantity of solder (9) located on a face of each of the arms of the support sheet; and means (11) for controlling flow of the solder, when heated, in a direction perpendicular to the line of weakness. The controlling means may be a strip of a resiliently deformable material.</p> |
