| 摘要 |
PURPOSE:To prevent short-circuit faults and defective insulation by holding outer leads and thin wires between a first die and a second die forming a molding cavity corresponding to a resin sealed body, forming the resin sealed body, and pulling and breaking the thin wires at the minimum cross-sectional parts. CONSTITUTION:A metal mold 40 is composed of a first die 41 and a second die 42. A molding cavity 43 for containing a supporting plate 16 for a lead frame 20 is formed. Outer leads and thin wires 30 and 31 are supported with the die 41 and the die 42. The frame 20 is mounted in the metal mold 40 so that the other main surface of the supporting plate 16 is separated from the bottom surface of the cavity 43. A sealing resin is pressed into the cavity 43. A part of the frame 20 is sealed with the resin 57. After the resin 57 is solidified, the frame 20 is taken out of the metal mold 40. The thin wires 30 and 31 which are protruding from a resin sealed body 21 are cut at minimum cross- sectional parts 33' and 34' formed with holes 35 and 34 by pulling. Thus, short circuit faults and defective insulation can be prevented. |
