DEVICE AND METHOD FOR SEPARATING PRINTED CIRCUIT BOARDS

摘要

A device separates attached multiple printed circuit boards without damaging solder connections and delicate surface mounted components attached to the boards. The device comprises a pair of disc cutters positioned in opposed alignment and minimally spaced apart for providing a bifurcated cutting edge through which commonly attached sections of the printed circuit boards are conveyed while supported by a transporter. The contact pressure on the boards is limited to the commonly attached sections as they are engaged and conveyed by the cutting edge. Minimal stress and vibrations are imparted to the boards and therefore the components connected thereon with this device. The boards are thus separated while avoiding damage to the solder connections or the surface mounted components.