| 摘要 |
Oxidation-preventing system for a wire welding (soldering) machine for welding (soldering) a wire 20 between a chip terminal and a mounting frame for a semiconductor device, the said wire 20 being constituted by a material subject to oxidation, such as copper or aluminium, in which a reducing gas intended to prevent oxidation of the wire 20 is supplied periodically around a reel 2 on which the said wire 20 is wound, at least one gas pipe for supplying the reducing gas is oriented towards each side of a capillary device 5 which withdraws the wire 20, the said gas pipes being arranged, just beneath the end of the capillary device 5, facing each other, and a torch is arranged facing an inner surface of one or other of the said gas pipes, and just beneath the capillary device 5. <IMAGE> |
