| 摘要 |
PURPOSE:To eliminate the formation of a resin burr on an external lead by providing a transparent resin body which adheres and fixed a lead frame inserted into the space of a housing while a photoelectric converting element is mounted. CONSTITUTION:A light emitting diode as the photoelectric converting element 15 and an integrated circuit element 17 are installed on each of lead frames 11 which are connected by tie bars by etching technique and connected to the lead frame 11 by bonding wires respectively to form the circuit of an optical transmission module. The lead frames 11 are inserted into lead frame insertion holes 35 of the housing 31 and positioned accurately so that the photoelectric converting elements 15 are on the center axes of the optical connector insertion holes 35. Plugs made of 'Teflon(R)' where the sticking of transparent resin is small are inserted into the optical connector insertion holes 343, transparent resin is injected through lead frame insertion holes 35 and cured into a transparent resin body 21, and the plugs are removed. Thus, the transparent resin is injected to form the transparent resin body 21 and the housing 31 and lead frame 11 are fixed, so no resin burr is formed on the external lead 13. |
