| 摘要 |
PURPOSE:To facilitate processing and improve work efficiency by joining a ceramic board for mounting a semiconductor to an opening of a printed wiring resin board, and connecting a printed wiring and a semiconductor chip through a wire. CONSTITUTION:A printed wiring 9 is provided to a printed wiring resin board 1. Next, an opening is bored at the center of the printed wiring resin board 1, and a ceramic board 2 for mounting a semiconductor chip 3 is made to adhere to this opening. Subsequently the semiconductor chip 3 is mounted, which is bonded to the printed wiring 9 using a wire 10, and as the last processing, a pin 4 is soldered to the printed wiring 9 making use of a through hole which is provided in advance in the printed wiring resin board 1. Since resin one is used for the printed board part where the pin 4 is provided this way, the processing becomes easy, and since the complicated work such as wire bonding, etc., can be done prior to mounting of the pin 4, the work efficiency can be improved. |
