Cooling box for dissipating the heat loss of semiconductors

摘要

Cooling box for dissipating the heat loss of semiconductors, in particular for power rectifiers. Such a cooling box consists of two shells having a nozzle for feeding and discharging the service water used as a liquid, in accordance with the main patent. In the case of this cooling box, an insulating plate made from an inorganic insulating material is arranged between the contact plate and the shell and soldered to both. The diameter of the insulating plate is greater than the diameter of the shell and of the contact plate. The insulating plate is glued to the shell and to the contact plate by means of a metal ceramic adhesive. Cooling box for dissipating the heat loss of semiconductors in vehicles, in particular in electric locomotives.