Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.
申请公布号
DE2551563(C2)
申请公布日期
1989.12.07
申请号
DE19752551563
申请日期
1975.11.17
申请人
AE PLC, RUGBY, WARWICKSHIRE, GB
发明人
BROWN, DENNIS COCKBURN;MURRAY, REGINALD, LEAMINGTON SPA, WARWICKSHIRE, GB
