| 摘要 |
PURPOSE:To provide the compsn. which sufficiently withstands an electroless gold plating treatment by using a resin contg. a naphthalene nucleus as a base and using a photopolymerizable compd. having a carboxyl group and ethylenic unsatd. group together with an epoxy compd. CONSTITUTION:This compsn. consists of the photopolymerizable unsatd. compd. expressed by formula I, the compd. having the epoxy group and a photopolymn. initiator or sensitizer and the ratios of the compd. having the epoxy group and the photopolymn. initiator or sensitizer per 100pts.wt. photopolymerizable unsatd. compd. are respectively 5-1,000pts.wt. and 0.1-30pts.wt. In formula, R1 and R2 are a group selected from a hydrogen atom, 1-5C alkyl group, etc.; R3 is a hydrogen atom or methyl group; R4 is a group selected from a hydrogen atom, methyl group, etc.; X is the residual group of an acid anhydride compd. The compsn. having the high resistance to electroless plating is obtd. in this way. |
