| 摘要 |
<p>PURPOSE:To form a compact and lightweight ebullition type coolihg module, by using a thin container having a large number of cylindrical projections as the parts corresponding to inner and outer fins of the module. CONSTITUTION:A substrate 5 mounted with semiconductor elements 6 and a container 8 having a large number of cylindrical projections a are sealed with each other through a packing 9 to form a cooling type module 10. A coolant 11 is enclosed in the module 10. Because the thin container having a large number of cylindrical projections is used as the parts corresponding to inner and outer fins of the module 10, it is possible to obtain a module inexpensive and excellent in cooling efficiency.</p> |
