| 摘要 |
PURPOSE:To reduce inspection time, by a method wherein a semiconductor device to be inspected is moved turning sequentially by a fixed angle to be taken sequentially at a fixed position so that a marking deficiency, a lead bending and a sealing defect are inspected. CONSTITUTION:A semiconductor device 1 within a supply pallet 2 is transferred to a supply conveyor 6 by five each with a supply pickup 4. After moved in the direction of the arrow C on a supply conveyor 6, the semiconductor device is transferred onto a turntable 8 with a turntable supply pickup 9. Then, it is inspected separately with a camera 11 for inspecting a mark deficiency, cameras 12a, 12b, 12c and 12d for inspecting a lead deficiency and a camera 13 for sealing defects while it is being moved turning on the turntable 8 in the direction of the arrow E to discriminate the propriety of the appearance thereof at a processing section. Among the semiconductor devices discriminated, those regarded as accepted are transferred to a housing conveyor 7 with a turntable housing pickup 10 to be moved in the direction of the arrow D on the housing conveyor 7. |
