摘要 |
<p>In oder to improve fixing between an electronic module (140) and the body (120) of a credit card made of plastic material, a housing (122, 134) is provided in the card body with bumps (130, 132) projecting into the housing. The electronic module (140) is pressed against the bumps (130, 132) while being raised to the softening temperature of the material from which the bumps are made. The module is pressed until its contact tabs (148) are level with the face (126) of the body. Fixing is completed by causing a glue to penetrate by capilarity between the bottom (124), the insulating substrate (142) of the electronic module, and the bumps (130, 132). The invention is particularly applicable to prepaid credit cards.</p> |