发明名称 MANUFACTURE OF MULTILAYER CERAMIC CIRCUIT BOARD
摘要 PURPOSE:To improve adhesion of conductor patterns formed on a ceramic board by using glass which contains a large proportion of sodium as a component of the conductor paste. CONSTITUTION:Glass containing a large proportion of sodium is used as a component of conductor paste. A multilayer ceramic board which has been baked is dipped in molten salt of potassium nitrate, so that ion exchange between sodium and potassium is carried out. A multilayer ceramic circuit board thus obtained is allowed to have improved adhesion between the conductor patterns and the ceramic board. If the conductor paste is just printed on the ceramic board and baked to provide the bond of glass bond type, it will inherently present poor adhesive strength. Accordingly, ion exchange is carried out between the conductor paste and the glass penetrated in the ceramic substrate to form a reinforced glass layer which substantially enhances the adhesive force of the conductor paste to the substrate.
申请公布号 JPH01300593(A) 申请公布日期 1989.12.05
申请号 JP19880130802 申请日期 1988.05.27
申请人 FUJITSU LTD 发明人 IMANAKA YOSHIHIKO;AOKI SHIGENORI
分类号 H05K3/46 主分类号 H05K3/46
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