| 摘要 |
PURPOSE:To easily assemble a cantilever without breakage by making a pedestal at the fixed end of the cantilever abut on an adhesive in the insertion groove of a package and mounting the cantilever on a heat-decomposed resin layer on the bottom surface of the package. CONSTITUTION:The insertion groove 12a is bored in the bottom surface in the package 12 at a position corresponding to the pedestal 11 made of silicon joined with the reverse surface of the fixed end part of the cantilever 1 with gold silicon eutectic alloy. The heat-decomposed resin layer 13 is stuck on the bottom surface in the package 12 except in the area of the pedestal insertion groove 12a to tens of mum so that its top surface is parallel to the bottom surface of the package 12. An adhesive 14 of epoxy resin is applied in the groove 12a, the cantilever 1 is mounted on the resin layer 13, and the pedestal 11 is pressed against the adhesive 14 in the groove 12a. Then the adhesive 14 is heated at, for example, 125 deg.C for two hours to cure. Further, the resin layer 13 is heated at, for example, 180 deg.C and removed by sublimation. Thus, the fixed end of the cantilever 1 is joined with the package 12 across the pedestal 11 and held in parallel to the bottom surface of the package 12. |
