| 摘要 |
<p>PURPOSE:To enable a efficient cutting to be stably performed, cuttings adhered to cutting blade being removed without interrupting the work, by providing a dressing member, which removes cuttings adhered to cutting blade, near the blade. CONSTITUTION:If an evaluation element is formed on dicing street 2a of a semiconductor wafer 2, cuttings of the protection film on the dicing stress 2a adhere to the surface of blade 3 at the time of this cutting work. Therefore, in the cutting process the cuttings adhered on the blade 3 during cutting work are removed by a dressing member 6 by pressing continuously or intermittently the dressing member 6 against the blade 3. In such a way the surface of the blade 3 can be dressed while the semiconductor wafer 2 is cut, so that the deterioration of currying efficiency due to cuttings can be prevented while the cleaning work with operational interruption is not necessary.</p> |
