| 摘要 |
<p>PURPOSE:To prevent adhesion of fine particles to an element forming surface, by performing dicing of a semiconductor wafer through the surface opposite to the element forming surface. CONSTITUTION:A semiconductor wafer 1 is held with a wafer.holder 2. In this instance, the semiconductor wafer 1 is held by turning the element forming surface 3 upside. Dicing of the semiconductor wafer 1 is performed by a dicing.saw 5 through the surface 4 opposite to the element forming surface 3. Therefore, generating fine particles hardly adhere to the element forming surface 3. In this instance, when a sucking mechanism sucking the fine particles is provided on a surface side opposite to the element forming surface, an effect of preventing adhesion of the fine particles to the element forming surface becomes far larger. A detecting method of a scribe line is performed by a method wherein infrared rays or supersonic waves penetrating a semiconductor wafer for which the dicing is going to be performed and their reflection or penetration signal is detected.</p> |
