发明名称 MANUFACTURE OF COPPER-PLATED PANEL
摘要 PURPOSE:To contrive to improve remarkably the wrinkles to be generated on a copper foil by arranging the metallic sheet having higher thermal expansion coifficient than the copper foil in between the mirror surface-plate with high surface-hardness and a laminate. CONSTITUTION:When a laminate is charged in between the hot platens of a press and a copper plated panel is produced by laminate-forming the laminate, the metallic sheet having larger thermal expansion coifficient than a copper foil, is inserted into between a mirror surface-plate and both the copper foil and the laminate to prevent the wrinkles of the copper foil from being generated. As such metallic sheet, the materials such as copper, copper base-alloy, aluminum, aluminum base-alloy, etc. are required, and as its thickness, the range of 0.05-0.1mm is preferably used. The forming process is especially effective in the laminate for multilayer-making in a complicated larger construction.
申请公布号 JPH01301214(A) 申请公布日期 1989.12.05
申请号 JP19880131471 申请日期 1988.05.31
申请人 MITSUBISHI GAS CHEM CO INC 发明人 TAKIGAWA SHUNICHI;SHIRAISHI RYUTA;HOSOYA KIYOSHI
分类号 B29C43/20;B29C43/32;B29K105/06;B29L9/00;H05K3/02 主分类号 B29C43/20
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