| 摘要 |
<p>PURPOSE:To prepare the title printed wiring board with high reliability in low cost, by forming a conductor layer, which closes a through-hole and forms a mount part, to the front surface of a substrate and using a base material in place of a mask to form a contact terminal by plating. CONSTITUTION:A through-hole 12 is preformed to the part corresponding to each contact terminal 15 of a substrate 11 and a copper foil is bonded to the rear of said substrate 11 to be set to a predetermined conductor layer 13. A space is formed to the part becoming the contact terminal 15 but a plating resist is formed so as to extend said space and the through-hole 12 is filled by plating or high speed partial plating and further filled so as to form a protruding plating part 14. In this case, controlling the amount of the plating part 14 filling said through-hole 12 allows the surface of the plating part 14 to protrude by 10-50mum from the substrate 11.</p> |
