发明名称 DEVICE FOR FORMING METALLIC COMPOUND
摘要 PURPOSE:To form the good-quality film of a metallic compd. at a stable depositing rate by transporting the atomized metal generated from a soln. reservoir and contg. metallic elements to the upper part, blowing a carrier gas against the outlet opening of a transport pipe, and supplying the material onto a substrate. CONSTITUTION:The soln. contg. the metallic elements of a desired metallic compd. in the soln. reservoir 1 is atomized by an ultrasonic atomizing means 2. The atomized material contg. the metallic elements is transported almost vertically upward by the transport pipe 3 having a cooling jacket 8. The carrier gas such as O2 is blown against the outlet opening 3a of the pipe 3 by a carrier gas blowing means 4 in the reaction chamber 5. The atomized material is transported by the carrier gas onto the substrate 6 placed on a holder 7. The metallic elements react with each other on the surface of the substrate 6 heated to a specified temp. by a heater 9 in the holder 7, and the film of the metallic compd. is deposited and formed.
申请公布号 JPH01298168(A) 申请公布日期 1989.12.01
申请号 JP19880128788 申请日期 1988.05.26
申请人 SONY CORP 发明人 MORI YOSHIFUMI;SUZUKI MASAYUKI
分类号 C01B13/14;C01B3/00;C01G1/00;C01G3/00;C23C16/40;C23C16/44;C23C16/448;C23C16/455 主分类号 C01B13/14
代理机构 代理人
主权项
地址