| 摘要 |
PURPOSE:To unite a high-frequency circuit and a low-frequency circuit and to realize the high integration of the circuits and the reduction of the capacity by adhering a multi-layered circuit board for the low-frequency circuit below a microstripper line. CONSTITUTION:A microstrip line consists of strip conductors 2 provided on the top surface of a dielectric substrate 1 and conductors 3 provided on the reverse surface of the substrate 1, and characteristic impedance is set by the dielectric constant of the substrate 1 and the thickness and width of the conductors 2. Then the multi-layered circuit board formed by laminating insulating substrates 5 having wiring formed by being patterned on the surfaces is adhered to the reverse surface of the microstrip line across insulating layers 6 provided on the reverse surface of a conductor layer 3. The wiring 4 is used as a power source line or the signal lines of the low-frequency circuit. |
