| 摘要 |
PURPOSE:To prevent the direct contact between metallic fine wires and scribe streets of a semiconductor chip from occurring by providing insulating protective chips on the sides and upper surface of the semiconductor chip. CONSTITUTION:Insulating protective chips 8 are provided on the sides and upper surface of a semiconductor chip 4 to position electrodes 4a near the central part of upper surface of the chip 4 while the electrodes 4a and outer leads 2a are wire bonded by metallic fine wires 6. Thus, the elongated metallic fine wires 6 sagging down due to their own deadweight are brought into contact with the insulating protective chips 8. Through these procedures, the metallic fine wires 6 do not come into direct contact with the scribed streets 4b formed on the peripheral parts of the upper surface of the semiconductor chip 4 covered with said chips 8. |
