TAPING METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER

摘要

The taping method and apparatus for preventing chip dispersion comprises the following of : locating the taping roller longer than the wafer at the upper site of the wafer and contacting the taping roller with the wafer by raising the wafer clinger and then rotating the axis of a part of taping roller palte supporting the taping roller. As the result, vapour generation is prevented by the shrinking force of vapour protected film formed on the taping roller.