| 摘要 |
<p>PURPOSE:To obtain the title inexpensive dicing tape whether irradiation or nonirradiation of ultraviolet light can be readily confirmed by the naked eye by fixing a semiconductor wafer through an adhesive layer having bond strength to reduce with ultraviolet rays to a tape substrate and forming a color changing material layer to change color with ultraviolet rays on the opposite face. CONSTITUTION:A tacky agent layer 2a is formed on a tape substrate 2b, a color changing material layer 5 is made on the face at the opposite side, a semiconductor wafer 4 is bonded to the tacky agent layer 2a, the tacky agent layer 2a is stuck to a annular ring 3 and the semiconductor wafer is diced. A dicing tape 6 is irradiated with ultraviolet rays from the side of the color changing material layer 5, the tacky agent layer 2a is cured, the semiconductor wafer 4 is picked up and the semiconductor wafer can be diced in high yield.</p> |
