| 摘要 |
PURPOSE:To eliminate copper foil and copper oxide from an organic base and to apply silane coupling agent of the organic base to acquire a printed wiring board with a high adhesiveness to the plated metal by bringing a treatment solution containing oxide into contact with the copper foil to form the copper oxide on a surface of the copper foil and by pressurizing, heating and laminating the insulating organic base on the surface thereof. CONSTITUTION:Copper foil coated with copper foil of a specified size is prepared for a printed wiring board. As a pretreatment, the copper foil is immersed in a specified degreasing solution for a specified time and immersed further in 10% aqueous sulfuric acid, and then washed by running water. Copper oxide formation treatment is applied under specified conditions to form copper oxide on the surface. After the copper oxide is washed by wash water, an insulating organic base is pressurized, heated and laminated on the surface thereof. Then the copper foil and the copper oxide are eliminated by persulfuric ammonium water solution, etc., silane coupling agent is applied to the insulating organic base and electroless plating is applied to the insulating organic base whereon the silane coupling agent is applied, to acquire a printed wiring board for an additive of highly adhesiveness to plating metal. |
