| 摘要 |
A thermally conductive interface for mounting encapsulated semiconductor devices 10 on a chassis or other surface comprises a soft, pliable plastic layer 16 of a synthetic resin consisting of silicone rubber, epoxy resin, polyester or poly-urethane bonded to a planar surface of the sheath portion 11 of the encapsulated semiconductor device. The pliable layer has a thickness less than 0.26mm and a hardness of between about 10 and 60 durometer (A-Shore scale). The layer may include metallic particles, alumina, boron nitride, or aluminium nitride to improve its thermal conduction and a layer 17 of adhesive may also be provided. <IMAGE> |
| 申请人 |
THE BERGQUIST CO., MINNEAPOLIS, MINN., US |
发明人 |
DEGREE, DAVID C., BURNSVILLE, MINN., US;FICK, HERBERT J., NORTHFIELD, MINN., US;HANSON, KEVIN L., BLOOMINGTON, MINN., US |
