| 摘要 |
PURPOSE:To prevent any crack in the mold main body from occurring by a method wherein polyimide resin films, etc., are formed on a die pad and inner lead parts of a lead frame to augment the bonding strength between the die pad, the inner lead parts and a sealing resin material. CONSTITUTION:Polyimide resin films 10 are formed on the part excluding an element loading surface 2a on a die pad 2 for loading semiconductor element 1 as well as the part excluding a bonding metal plating 6 on inner lead parts 4a of a lead frame 4 to mold-form the outsides of the polyimide films 10 out of sealing resin material for forming the mold main body 7 through the intermediary of the polyimide resin films 10. Consequently, the die pad 2 and the inner lead parts 4a of the lead frame 4 are closely bonded to the sealing resin material comprising the main body 7 through the intermediary of the polyimide resin films 10 to secure the high bonding strength. Through these procedures, the crack in the mold main body due to the change in temperature in case of mounting a device as well as the thermal stress after moisture absorption can be prevented from occurring pertinently and without fail. |
