发明名称 METAL MOLD FOR RESIN SEALING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To increase the resin sealing efficiency by a method wherein the total effective space of a metallic force is expanded by providing an intermediate metallic force between a top metallic force and a bottom metallic force. CONSTITUTION:One half 8 in the first cavity is formed into the bottom surface of the top metallic force 4 while the other half 34 is formed into the upper surface of the intermediate metallic force 24 besides one half 36 in the second cavity is formed into the bottom surface of the intermediate force 24 which the other half 18 is formed into the upper surface of the bottom metallic force 6. Consequently, the total effective space of the metal mold 22 can be expanded by the intermediate metallic force 24 between the top metallic force 4 and the bottom metallic force 6. Through these procedures, the resin sealing efficiency per shot can be increased.
申请公布号 JPH01296631(A) 申请公布日期 1989.11.30
申请号 JP19880127473 申请日期 1988.05.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIDA MINORU
分类号 B29C45/32;B29L31/34;H01L21/56 主分类号 B29C45/32
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