| 摘要 |
PURPOSE:To contrive improvement in working efficiency, miniaturization and reduction in production cost by a method wherein elements are brought in a mold, in which one or more electronic component elements can be housed, of the structure made of the material having good mold-releasing properties, and both impregnating and sheathing works are conducted simultaneously. CONSTITUTION:A number of elements 1 are arranged on a jig 8 leaving regular intervals, a lead wire 2 is fixed using an adhesive tape 10, and an element main body 11 is fittingly housed in a compartment 12 of a mold 3. Subsequently, a number of these elements 1 are dipped together with the mold 3 into a resin vessel 9 in the air or in an atmosphere depressed to the prescribed atmospheric air pressure. After the lapse of the prescribed time, the elements 1 are picked out from the mold 3 together with the mold 3, and resin 4 is hardened by a heater 13. After the resin has been hardened, the mold 3 is opened, and a completed capacitor C, which is impregnated and sheathed, is taken out from the mold 3. As a result, a smallsized electron part of excellent quality can be manufactured at low cost in an efficient manner. |
