| 摘要 |
PURPOSE:To reduce residual stress at an interface between a lead frame and resin by resin-molding a chip and heating the same after opening a die reaction of the resin. CONSTITUTION:Phenol novolac type epoxy resin containing a 50-80% molten quartz filler is available as the resin. The resin is molded and a die is opened. For separation of call runners, a gate of a molded product is locally and instantaneously cooled only in the vicinity thereof and cut down by pressing. Liquid N2 is used for the cooling. The products are arranged in order and heated using hot air. A package of the product is kept substantially at glass transition temperature Tg of the resin and sufficiently reacted, and thereafter cooled at ordinary cooling temperature. Hereby, residual stress in the packing is reduced. Furthermore, in a continuous production process, the temperature is controlled using a combination of a molding machine 21, transfer device 24, and a heating/housing device 26. Thus, processing time for the device at high temperature can sharply be reduced to realize short delivery time and rationalization of production. |
