| 摘要 |
PURPOSE:To prevent damage of a board, by providing a polyimide layer thickly at the periphery of the rear surface of the board, cutting the intermediate part of the thick layer when the thick layer is formed or after the thick layer is formed, thereby providing a groove part for preventing water absorption, providing a metal thin film layer on the polyimide layer and the groove part, and bonding the layer to a flange by soldering. CONSTITUTION:A polyimide layer 15 is thickly attached to the periphery of a rear surface 2b of a printed board 2. Then, the intermediate part of the polyimide layer 15 is cut and removed, and a groove part 15a is provided. A metal thin film layer 12 is attached on the surfaces of the polyimide layer 15 and the groove part 15a so that soldering can be performed. Then, the metal thin film layer 12 on the board 2 and a flange 10 are aligned. A gap between both parts 12 and 10a is filled with a solder 13, and sealing is achieved by the bonding. Therefore, the metal thin film layer 12 on the side of the board 2 is rigidly bonded to the polyimide layer 15. Thus, the board 2 and the flange 10a are strongly bonded. In this way, damage of the board can be prevented.
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