| 摘要 |
PURPOSE:To prevent the deformation of an inner lead in wire bonding, by forming a recess part in the surface of the stage so that at least the tip part of the rear surface of the inner part is not in contact with the surface of a stage. CONSTITUTION:A recess part 32 is formed in the perpendicular direction with respect to the extending direction of an inner lead 4a at the outside of a positioning projection 31 in a stage surface F. The stage surface F is not in contact with the inner lead 4a at the tip part of the inner lead 4a owing to the recess part 32. Even if the plated material at the tip of the inner lead 4a is fused due to the heating of a lead frame 4 and moved into the rear side of the inner lead 4a, the non-contact state between the tip part of the rear surface of the inner lead 4a and the stage surface F is maintained with the recess part 32 which is formed in the stage surface F. Therefore, junction between the inner lead 4a and the stage surface F through the plated material is prevented. Thus, the deformation of the inner lead 4a is prevented, and a highly reliable semiconductor device can be obtained. |
