发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve integration scale, by forming a groove from the surface of a single crysal silicon substrate, forming a gate electrode on the side wall of the groove through a gate insulating film, forming a diffused layer on the bottom part of the groove, and forming a lead-out electrode from the diffused layer through an interlayer insulating film which covers the gate electrode. CONSTITUTION:A groove is formed from the surface of an Si substrate 1. A gate insulating film 3 is formed on the side wall of the groove. An embedded diffused Iayer 2 is formed on the bottom part of the groove. A gate electrode 4 is formed on the surface of the gate insulating film 3. An interlayer insulating film 5 is formed on the surface of the gate electrode 4. A lead-out electrode 6 which is continued to the embedded diffused layer 2 is formed through the interlayer insulating film 5. Diffused layers which are formed on both ends of the groove are used as a source (1) 7 and a source (2) 8. The gate electrode 4 is used as a gate (1) 9 and a gate (2) 10. The lead-out electrode 6 is used as a device for an output 11. Two MOS type field effect transistors constituted in this way form an inverter circuit. Thus, the scale of integration is improved.
申请公布号 JPH01295461(A) 申请公布日期 1989.11.29
申请号 JP19880126307 申请日期 1988.05.24
申请人 SEIKO EPSON CORP 发明人 IWAMATSU SEIICHI
分类号 H01L21/8238;H01L27/092;H01L29/41;H01L29/78 主分类号 H01L21/8238
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